Icocekile kwaye ihlala ixesha elide, i-PEEK yenza uphawu lwayo kwii-semiconductors

Njengoko ubhubhani we-COVID-19 uqhubeka kwaye imfuno yeechips iqhubeka nokunyuka kumacandelo ukusuka kwizixhobo zonxibelelwano ukuya kubathengi be-elektroniki ukuya kwiimoto, ukunqongophala kweetshiphusi kwihlabathi liphela.

I-Chip yinxalenye ebalulekileyo yecandelo lobugcisa bolwazi, kodwa kunye noshishino oluphambili oluchaphazela yonke intsimi ye-high-tech.

Ukwenza itshiphu enye yinkqubo entsonkothileyo ebandakanya amawakawaka amanyathelo, kwaye isigaba ngasinye sale nkqubo sizaliswe bubunzima, kubandakanywa amaqondo obushushu agqithisileyo, ukuchanabeka kwimichiza eyingozi kakhulu, kunye neemfuno zokucoceka okugqithisileyo. Iiplastiki zidlala indima ebalulekileyo kwinkqubo yokuvelisa i-semiconductor, iiplastiki ze-antistatic, i-PP, i-ABS, i-PC, i-PPS, izinto ze-fluorine, i-PEEK kunye nezinye iiplastiki zisetyenziswa ngokubanzi kwinkqubo yokuvelisa i-semiconductor. Namhlanje siza kujonga ezinye zezicelo iPEEK enazo kwiisemiconductors.

I-Chemical mechanical grinding (CMP) yinqanaba elibalulekileyo lenkqubo yokuvelisa i-semiconductor, efuna ukulawulwa kwenkqubo engqongqo, ukulawulwa ngokungqongqo kwimilo yomhlaba kunye nomgangatho ophezulu. Intsingiselo yophuhliso lweminiaturization ibeka phambili iimfuno eziphezulu zenkqubo yokusebenza, ngoko ke iimfuno zokusebenza zeringi esisigxina ye-CMP ziya zinyuka ngokunyuka.

Iringi ye-CMP isetyenziselwa ukubamba i-wafer kwindawo ngexesha lenkqubo yokusila. Izinto ezikhethiweyo kufuneka ziphephe imikrwelo kunye nongcoliseko kwi-wafer surface. Ngokuqhelekileyo yenziwe ngePPS eqhelekileyo.

I-PEEK ibonakalisa uzinzo oluphezulu, ukucutshungulwa ngokulula, iipropathi ezilungileyo zoomatshini, ukumelana neekhemikhali, kunye nokumelana nokunxiba kakuhle. Xa kuthelekiswa neringi ye-PPS, i-CMP esisigxina yeringi eyenziwe nge-PEEK inokunganyangeki okukhulu kunye nobomi benkonzo kabini, ngaloo ndlela inciphisa ixesha lokuphumla kunye nokuphucula imveliso ye-wafer.

Ukwenziwa kweWafer yinkqubo entsonkothileyo nenyanzelisayo efuna ukusetyenziswa kwezithuthi ukukhusela, ukuthutha, kunye nokugcina iiwafers, ezifana neebhokisi ezingaphambili ezivulekileyo zokudluliselwa kwewafer (iiFOUPs) kunye neengobozi zamawafa. Abathwali be-Semiconductor bahlula kwiinkqubo zokusasaza ngokubanzi kunye neenkqubo ze-asidi kunye nesiseko. Ukutshintsha kobushushu ngexesha lokufudumeza kunye neenkqubo zokupholisa kunye neenkqubo zonyango lweekhemikhali zingabangela utshintsho kubukhulu bezithuthi ezithwala i-wafer, okubangelwa ukukrala kwe-chip okanye ukuqhekeka.

I-PEEK ingasetyenziselwa ukwenza izithuthi kwiinkqubo zokuhambisa ngokubanzi. I-PEEK ye-anti-static (PEEK ESD) isetyenziswa ngokuqhelekileyo. I-PEEK ESD ineempawu ezininzi ezibalaseleyo, ezibandakanya ukumelana nokunxiba, ukumelana neekhemikhali, ukuzinza kwe-dimensional, ipropathi ye-antistatic kunye ne-degas ephantsi, enceda ukuthintela ukungcoliseka kwamasuntswana kunye nokuphucula ukuthembeka kokuphathwa kwe-wafer, ukugcinwa kunye nokudluliselwa. Ukuphucula ukuzinza kwebhokisi engaphambili evulekileyo yokudluliselwa kwe-wafer (FOUP) kunye nebhaskithi yeentyatyambo.

Ibhokisi yemaski epheleleyo

Inkqubo yeLithography esetyenziselwa imaski yegraphical kufuneka igcinwe icocekile, ibambelele kwisigqubuthelo sokukhanya kulo naluphi na uthuli okanye imikrwelo kwintelekelelo yokuthotywa komgangatho, ke ngoko, imaski, nokuba ikwimveliso, ukusetyenzwa, ukuhambisa, ukuthutha, inkqubo yokugcina, zonke kufuneka zithintele ukungcoliseka kwemaski kunye ifuthe lesuntswana ngenxa yongquzulwano kunye nococeko lwemaski yefriction. Njengoko ishishini le-semiconductor liqala ukwazisa itekhnoloji yokukhanya kwe-ultraviolet (EUV) egqithisileyo yokukhanya, imfuno yokugcina iimaski ze-EUV zingenasiphako iphezulu kunangaphambili.

Ukukhutshwa kwe-PEEK ESD ngobunzima obuphezulu, amasuntswana amancinci, ukucoceka okuphezulu, i-antistatic, ukumelana nokugqwala kweekhemikhali, ukumelana nokunxiba, ukumelana ne-hydrolysis, amandla abalaseleyo e-dielectric kunye nokuchasana okugqwesileyo kwiimpawu zokusebenza kwemitha, kwinkqubo yokuvelisa, ukusasaza kunye nokucubungula imaski, inokwenza I-mask sheet egcinwe kwi-degassing ephantsi kunye nongcoliseko oluphantsi lwe-ionic yokusingqongileyo.

Uvavanyo lweChip

I-PEEK ibonakalisa ukumelana nobushushu obuphezulu, ukuzinza komda, ukukhutshwa kwerhasi ephantsi, ukuphalazwa kwamasuntswana asezantsi, ukuxhathisa ukubola kweekhemikhali, kunye nomatshini olula, kwaye ingasetyenziselwa uvavanyo lwetshiphu, kubandakanya iipleyiti zobushushu obuphezulu bematriki, iindawo zovavanyo, iibhodi zesekethe eziguquguqukayo, iitanki zokuvavanya kwangaphambili. , kunye nezihlanganisi.

Ukongeza, ngokunyuka kolwazi lwendalo esingqongileyo kugcino lwamandla, ukunciphisa ukukhutshwa kunye nokunciphisa ungcoliseko lweplastiki, ishishini le-semiconductor likhuthaza ukwenziwa kohlaza, ngakumbi imfuno yentengiso ye-chip yomelele, kwaye imveliso ye-chip ifuna iibhokisi ze-wafer kunye nezinye izinto ezifunwayo zinkulu. impembelelo ayinakujongelwa phantsi.

Ke ngoko, ishishini le-semiconductor licoca kwaye liphinde lisebenzise iibhokisi ze-wafer ukunciphisa inkcitho yemithombo.

I-PEEK inelahleko encinci yokusebenza emva kokufudumeza okuphindaphindiweyo kwaye i-100% iphinda isetyenziswe.